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v Cst Microwave Studio
v FEKO recent progress on the antenna simulatio..
v FEKO Getting Started Manual
v Fundamentals of VHDL-AMS for High-Speed Buffe..
v PCB Design and SMT Assembly/Rework Guidelines..
v SMT Soldering Handbook
v Vhdl Actel Code
v Writing Testbench-Functional Verification Of ..
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  Cst Microwave Studio 2009-11-20 268 615.52 KB
The second example introduces dielectric material into the model and sets local mesh properties. To illustrate the use of dielectric regions, a patch antenna on a substrate is used. Dielectric material modelling in FEKO is not restricted to pl..    
 
  FEKO Getting Started Manual 2009-11-20 61 981.35 KB
1 Introduction The first section in this Getting Started manual discusses the installation of FEKO under MS Windows on PC’s and on UNIX workstations. Note that the graphical user interface (CADFEKO, EDITFEKO and POSTFEKO) is currently only a..    
 
  FEKO recent progress on the antenna simulation 2009-11-20 80 434.02 KB
All course labs will be completed using the SystemVision analysis platform. SystemVision is a design and analysis tool suite, composed of three integrated tools: • Schematic Capture Program - the front-end design portion of SystemVision...    
 
  Fundamentals of VHDL-AMS for High-Speed Buffer Modeling 2009-11-20 52 1172.61 KB
Welcome to the Fundamentals of VHDL-AMS for High-Speed Buffer Modeling course. This course is intended as a brief primer for the VHDL-AMS modeling language, with a high-speed buffer focus. What We Will Cover: • VHDL-AMS Overview Here ..    
 
  PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages 2009-11-20 47 4785.37 KB
INTRODUCTION Skyworks' Multichip Module-Laminate (MCM-L) package is a system solution that combines both active and passive functions on a module. MCM-L technology has been used in most of Skyworks’ Power Amplifier (PA) modules and related ..    
 
  SMT Soldering Handbook 2009-11-20 32 2689.63 KB
The oxide skin on molten solder In a normal atmosphere, a thin skin of oxide forms almost immediately on the surface of molten solder as soon as it is exposed to atmospheric oxygen. This skin acts like a tough, somewhat rigid envelope on the ..    
 
  Vhdl Actel Code 2009-11-20 26 684.47 KB
    
 
  Writing Testbench-Functional Verification Of Hdl Models(Aldec) 2009-11-20 25 13259.47 KB
    
 
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